This epoxy adhesive is specifically designed for food contact applications, offering a robust bond to metals, ceramics, and glass. It provides exceptional resistance to temperature variations and moisture, ensuring reliable performance in packaging and sealing applications.
Technical Specifications
pH Level: Neutral at curing
Shelf Life: 12 months when stored in a cool, dry place
Batch Size: 200 L
Processing Time: 2 hours across all phases
Temperature: 60°C for Resin Phase, 40°C for Curing Phase
Storage: Store in sealed containers at 15-25°C with humidity levels below 60%
Viscosity: 8000-12000 cps
Certification: FDA 21 CFR 175.300, EU Framework Regulation (EC) No 1935/2004
Thickening agent to enhance viscosity and stability
Food Grade Dye
1.0%
Provides color tracers for application verification
Manufacturing Process
Resin Phase
Heat Bisphenol A Epoxy Resin to 60°C in a double jacketed mixing vessel for 30 minutes.
Add silica while continuously stirring at 500 rpm using a high-shear mixer.
Monitor viscosity, aiming for a range of 8000-12000 cps.
Curing Phase
Slowly blend in Polyamide Curing Agent at 40°C, maintaining agitation at 300 rpm.
Add food-grade dye and mix until homogeneously distributed for 20 minutes.
Check for homogeneous dispersion under UV light.
Usage Instructions
Apply an equal mixture of parts A and B evenly on the surfaces to be bonded. Allow to cure at room temperature for 24 hours before exposure to high moisture or temperature environments.