Industrial Hot Melt Tape Formulation

This formulation offers high-performance pressure-sensitive adhesion, activated by heat to bond efficiently with materials like cardboard, plastics, and metals. Ideal for industrial packaging and logistics, it ensures a clean strip application, with superior holding power under various pressures.

Technical Specifications

  • pH Level: Not applicable for non-aqueous systems
  • Shelf Life: 2 years when stored in a cool, dry place below 25°C
  • Batch Size: 1000 kg
  • Processing Time: 4 hours including cooling
  • Temperature: 170°C - 120°C for different phases
  • Storage: Store in a cool, dry environment, protected from direct sunlight and moisture.
  • Viscosity: 10,000-15,000 mPa·s at 150°C
  • Certification: Complies with RoHS and REACH standards

Ingredients

IngredientPercentageFunction
Ethylene Vinyl Acetate45.0%Provides flexibility and adhesion in the adhesive matrix
Hydrogenated Hydrocarbon Resin35.0%Enhances tackiness and adhesion to various substrates
Paraffin Wax10.0%Improves processing stability and offers additional flexibility
Antioxidant2.0%Prevents thermal degradation and extends shelf life
Fischer-Tropsch Wax8.0%Modifies viscosity and enhances temperature resistance

Manufacturing Process

Melting Phase

  1. Heat Ethylene Vinyl Acetate in a jacketed vacuum mixer to 170°C, stirring until fully melted.
  2. Gradually add Hydrogenated Hydrocarbon Resin while maintaining temperature and mix for 30 minutes ensuring homogeneity.

Blending Phase

  1. Add Paraffin Wax and Fischer-Tropsch Wax to the mixer, maintaining a temperature of 160°C.
  2. Ensure continuous mixing for an additional 20 minutes once all components are homogenized.

Additive Integration

  1. Introduce Antioxidant into the blend at 150°C, mixing for 10 minutes.
  2. Conduct quality check for homogeneity and adjust mixing time as needed.

Final Processing and Cooling

  1. Slowly reduce temperature to 120°C, ensuring that all components remain fully integrated.
  2. Pour the mixture into silicone-lined molds for cooling and solidification.

Usage Instructions

Heat adhesive layer to a recommended temperature of 150°C before applying pressure onto substrates. Use a suitable roller or pressure applicator for optimal adhesion.

View full formulation details on AIFormulator